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WHAT IS GW6113A/B?
6113A / B is a two-component solventless, room temperature curing epoxy potting material for
automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity
requirements of the product package protection, and has excellent adhesion and heat resistance.
FEATURES
Heat curing will bring high heat resistance
Excellent adhesion, anti-cracking
Low CTE linear expansion coefficient
Having a high thermal conductivity
Excellent electrical insulation, stability
Long-term use at 150 ℃ -180 ℃
Very low water absorption, good waterproof, moisture resistance
WHAT IS GW6113A/B?
6113A / B is a two-component solventless, room temperature curing epoxy potting material for
automotive, automotive electronics, power tools, reactors, instruments with high thermal conductivity
requirements of the product package protection, and has excellent adhesion and heat resistance.
FEATURES
Heat curing will bring high heat resistance
Excellent adhesion, anti-cracking
Low CTE linear expansion coefficient
Having a high thermal conductivity
Excellent electrical insulation, stability
Long-term use at 150 ℃ -180 ℃
Very low water absorption, good waterproof, moisture resistance
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